DALP® Technology: Precise Control at the Atomic Scale

HOW IT WORKS
Our Direct Atomic Layer Processing technology uses proprietary microchemical reactors to deposit materials exactly where needed, building complex structures one atomic layer at a time. Think of it as 3D printing at the atomic scale—precise, controlled, and capable of creating structures that were previously impossible to manufacture.
WHY IT´S BETTER
Unlike traditional fabrication methods that require multiple steps, masks, and cleanrooms, DALP® technology directly prints materials atom by atom. This means you can: Create complex multi-material structures in a single step Build precise gradients down to 0.3 nanometers Work with hundreds of materials including metals, semiconductors, and oxides Achieve uniform coatings even on challenging 90° angles and deep cavities
US VS THEM
Traditional Method
2-week process
Multiple machines
Complex clean room setup
Limited material combinations
Fixed patterns
DALP® Technology
1-day process
Single tool
Benchtop operation
Multi-material capabilities
Dynamic, adjustable designs
 

Precision

  • 0.3 nm step height
  • Multi-material capability
  • Atomic-level control

    • Speed

  • Weeks to days
  • Rapid prototyping
  • Quick iteration cycles

    • Flexibility

  • Hundreds of materials
  • Multiple substrates
  • Complex geometries

    • Efficiency

  • No cleanroom needed
  • 90% less waste
  • Lower operating costs
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    Technical
    Specifications Highlight

    • Atomic-level design
      Create multilayer structures atom by atom in a single process step.
    • Complex geometry mastery
      Uniform coatings on 90° walls, deep cavities (up to 60 microns), and intricate nanostructures.
    • Novel devices
      Fabricate advanced devices like Bragg mirrors, MIM capacitors, and vertical interconnections.

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