The R-200 Advanced ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewelry, coins, and medical implants.

The R-200 Advanced ALD system is the global market leader in advanced ALD research tools with hundreds of customer installations. It has become the tool of choice both for companies and research institutes driven by innovation.
•50-200 mm single wafers
•156 mm x 156 mm solar Si wafers
•3D objects
•Powders and particles
•Mini-batch
•Porous, through-porous, and high aspect ratio (up to 1:2500)
•50 – 500°C, plasma 450°C (650 °C with heated chuck on request)
•Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZnO, ZrO2, AlN, TiN, metals such as Pt or Ir
•Manual loading with a pneumatic lift
•Load lock with magnetic manipulator arm
•Semi-automatic loading with handling robot
•Cassette-to-cassette loading with cluster tools
•Liquid, solid, gas, ozone, plasma(*)
•Up to 12 sources with 6 separate inlets (7 if the plasma option is chosen)
•Cluster tools, Picoflow™ diffusion enhancer, roll-to-roll chamber, RGA, UHV compatibility, N2 generator, gas scrubber, customized designs, glove box integration for inert loading
 
Si desea información sobre cualquier producto, solicitar una oferta o realizar un pedido puede hacerlo a través del siguiente formulario. También llamando al 910 097 846. Estaremos encantados de atenderle.