Atomic Layer Deposition (ALD) is an advanced thin film coating method which is used to fabricate ultrathin, highly uniform and conformal material layers for several applications.
ALD uses sequential, self-limiting and surface-controlled gas phase chemical reactions to achieve control of film growth in the nanometer/sub-nanometer thickness regime. Due to the film formation mechanism – the gases won’t react until in touch with the surface which means the film growth proceeds by consecutive atomic layers “up” from the surface – the ALD film is dense, crack-, defect- and pinhole-free and its thickness and structural and chemical characteristics can be precisely controlled on atomic scale.
ALD process is digitally repeatable and it can be performed at relatively low temperatures. This gives the possibility to construct not only single material layers but also doped, mixed, or graded layers and nanolaminates, whereas low process temperature allows coating of also sensitive materials such as plastics and polymers.
The list of ALD materials is wide, ranging from e.g. oxides, nitrides, fluorides, carbides, and sulfides to ternary compounds, metals (including noble ones), hybrid materials and polymers.
Picosun is the inventor of ALD.
Dr. Tuomo Suntola, the inventor of ALD, is a Member of Picosun Board of Directors.
Picosun’s unique, groundbreaking ALD expertise reaches back to the birth of the ALD technology itself. Dr. Tuomo Suntola, who invented and patented the ALD method for industrial purposes in Finland in 1974, is a Member of Picosun Board of Directors, and our former CTO, Mr. Sven Lindfors, was well-known throughout the ALD community thanks to his experience in high quality ALD system designs since 1975. Highly committed Picosun personnel has an unparalleled amount of ALD experience and it has contributed to a significant number of patents in ALD. Our long history and comprehensive expertise make Picosun the optimal partner in all your ALD needs.
Helium 3 is official distributor of Picosun in Spain.
